UMC Posts Strong Q2 Earnings, Sees AI Revenue More Than Triple in 3 Years
Board approves multi-year $5 billion budget to build out 12-inch silicon photonics and 3D advanced packaging capacity.
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TechSoda Insight: Microsoft & AMD Double Down on Full-Rack AI Infrastructure
Microsoft’s latest Azure infrastructure update (July 20, 2026, announced by Cloud + AI EVP Scott Guthrie) signals a significant shift in how hyperscalers build and deploy AI capacity.
IP Insight: What Defensive Leverage Does TSMC Hold Against HPE's Infringement Claim? (Part 2)
In the global semiconductor supply chain, patent litigation has always been an extension of commercial competition.
Beyond Moore’s Law: How Advanced Packaging May Become the New Geopolitical Chessboard
How the Post-Moore’s Law Era and Apple's CXMT Lobbying Signal a New Paradigm of Weaponized Interdependence
IP Insight: Why the Latest Patent Lawsuit Won’t Easily Break TSMC’s Shield (Part 1)
The global semiconductor landscape is no stranger to legal warfare, but the latest U.S.
Huawei’s Chip Breakthrough: Genuine Leap or Strategic Hype?
Can Huawei Really Beat U.S. Sanctions with a New Chip Breakthrough?
TSMC Unveils A13 Process Technology in 2026 North America Technology Symposium
TSMC, the world’s leading semiconductor foundry, held its 2026 North America Technology Symposium on April 22 (local time).
NAND Flash Shortage to Intensify Through 2027 as AI Demand Triggers "Structural Shift"
Silicon Motion’s Wallace Kou: AI Demand is Real, but "Broken Chains" Risk Looms for Automotive and Industrial Sectors.
Beyond Displays: Taiwan’s Panel Giants Pivot Toward the Semiconductor Gold Rush
How Taiwan’s Touch Taiwan 2026 Becomes a Stage for Industry Transformation and Resilience
The Terawatt Transition: Inside Musk’s Galactic Terafab Vision
Scaling the Kardashev Scale through Vertical Integration and Space-Bound Compute