Marvell Lands Major Deal with Google
Marvell wins Google custom chip deal, TPU expansion, and up to $12B warrant stake in AI infrastructure race.
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U6G "Golden Spectrum" Debuts, RadRock Strengthens RF Core
U6G golden spectrum RF solution by RadRock boosts 6G connectivity and device performance.
Meta's First Training Chip Makes Official Debut
Meta MTIA 300 training chip with built‑in NICs, collective offload, and near‑memory compute delivers superior DLRM performance and cost advantages over GPUs.
Fiberglass Cloth Shortage: Exceptionally Severe!
PCB material costs surge as Nan Ya raises CCL and PP prices 20–25%. Fiberglass cloth shortage worsens, supply tight through 2027, driving downstream price hikes.
Intel: A Return to Storage?
Intel rethinks memory strategy with new architectures, advanced packaging, and foundry services, aiming to redefine computing and storage integration in the AI era.
Chips: Getting Bigger and Bigger!
How TSMC, Intel, and Samsung scale AI chips from nanometers to 14× reticle size with CoWoS, EMIB, and 3D stacking—yield, thermal, and system challenges explained.
SerDes: The Decisive Factor
How SerDes high speed interconnect IP drives AI ASIC competition, with 448G adoption reshaping data center chips and cloud vendor strategies.
TSMC Advanced Packaging: Latest Insights
TSMC reveals latest advanced packaging progress including CoWoS capacity, 5.5x reticle mass production with 98% yield, SoIC hybrid bonding, and ABF substrate challenges in the AI era.
Next-Gen EUV Lithography: Samsung Decides
Samsung targets 1nm chip mass production with High-NA EUV by 2030, challenging TSMC and Intel in next-gen lithography.
All Eyes Are on EUV Lithography Machines
EUV lithography is expanding beyond top five chipmakers as second-tier fabs adopt it, while new challengers target ASML's dominance.
Is Musk About to Disrupt EUV Lithography?
Elon Musk may disrupt EUV lithography using FEL technology. Explore the potential and challenges of this next generation light source.
America Bets on the "Post-GPU Era"
US shifts chip strategy from factory subsidies to equity stakes in seven disruptive tech firms, betting on CPO, ferroelectric memory, and post-GPU innovations.