# tsmc (news sources) — RSS Amplifier Recent posts from the 2 feeds in the RSS Amplifier directory that cover tsmc. Page: Feed: --- ## [No One’s No.1 Problem](https://www.electronicsweekly.com/blogs/mannerisms/dilemmas/no-ones-no-1-problem-2026-08/) _2026-08-21 · David Manners · Electronics Weekly_ New records for high temperatures keep getting set but climate change has still not reached the top of the agenda for many people. None of the respondents in the 32 \[…\] The post No One’s No.1 Problem appeared first on Electronics Weekly . ## [Quantum technologies rush out of US labs to match China’s growth](https://www.electronicsweekly.com/news/research-news/quantum-technologies-rush-out-of-us-labs-to-match-chinas-growth-2026-08/) _2026-08-20 · EW Staff · Electronics Weekly_ The Trump administration is pushing US quantum information science and technologies (QISTs) out of the lab as the first products mature, more private investment arrives, and Washington strives to match \[…\] The post Quantum technologies rush out of US labs to match China’s growth appeared first on Electronics Weekly . ## [Fable: The Anti-Vision CEO](https://www.electronicsweekly.com/blogs/mannerisms/fable/fable-the-anti-vision-ceo-2026-08/) _2026-08-20 · David Manners · Electronics Weekly_ Over 30 years ago, the incoming CEO of a company which had just made the largest loss in US history declared that the last thing the company needed was a \[…\] The post Fable: The Anti-Vision CEO appeared first on Electronics Weekly . ## [How to choose connectors for eVTOL aircraft](https://www.electronicsweekly.com/news/business/how-to-choose-connectors-for-evtol-aircraft-2026-08/) _2026-08-20 · EW Staff · Electronics Weekly_ Electrical architectures with a selection of connectors are key to facilitating the reliable transmission of power and data under extreme operational conditions for aircraft, writes Sean Fitall. Electric Vertical Takeoff \[…\] The post How to choose connectors for eVTOL aircraft appeared first on Electronics Weekly . ## [Don’t Scrap It, Save It: Feedforward Control For Modern Semiconductor Manufacturing](https://semiengineering.com/dont-scrap-it-save-it-feedforward-control-for-modern-semiconductor-manufacturing/) _2026-08-20 · Swapnil Kailash More · Semiconductor Engineering_ By measuring each wafer after lithography and adjusting the next etch step, fabs can pull more wafers back into spec. The post Don’t Scrap It, Save It: Feedforward Control For Modern Semiconductor Manufacturing appeared first on Semiconductor Engineering . ## [From Research To Production: Collaboration Is Key For Semiconductor Innovation](https://semiengineering.com/from-research-to-production-collaboration-is-key-for-semiconductor-innovation/) _2026-08-20 · Germain Fenger · Semiconductor Engineering_ Semiconductor R&D depends on access to high-quality data, realistic process assumptions, and practical learning from silicon. The post From Research To Production: Collaboration Is Key For Semiconductor Innovation appeared first on Semiconductor Engineering . ## [How Will The Custom HBM Business Work?](https://semiengineering.com/how-will-the-custom-hbm-business-work/) _2026-08-20 · Bryon Moyer · Semiconductor Engineering_ There is no one-size-fits-all — yet. The post How Will The Custom HBM Business Work? appeared first on Semiconductor Engineering . ## [Reducing Scope 3 Value Chain Emissions For Customers Through Sustainability And Innovation](https://semiengineering.com/reducing-scope-3-value-chain-emissions-for-customers-through-sustainability-and-innovation/) _2026-08-20 · Madison West · Semiconductor Engineering_ Reducing manufacturing-related emissions may support lowering the embedded carbon footprint of the chips customers use in their products. The post Reducing Scope 3 Value Chain Emissions For Customers Through Sustainability And Innovation appeared first on Semiconductor Engineering . ## [Three Strategic Imperatives For Energy-Efficient AI Computing](https://semiengineering.com/three-strategic-imperatives-for-energy-efficient-ai-computing/) _2026-08-20 · Pushkar Apte · Semiconductor Engineering_ Reducing energy consumption is key to both lowering inference cost and enabling emerging physical AI applications. The post Three Strategic Imperatives For Energy-Efficient AI Computing appeared first on Semiconductor Engineering . ## [Managing Thermal Expansion And Electromigration Through Interposer Design](https://semiengineering.com/managing-thermal-expansion-and-electromigration-through-interposer-design/) _2026-08-20 · Katherine Derbyshire · Semiconductor Engineering_ New deep learning models may provide a pathway for modeling warpage. The post Managing Thermal Expansion And Electromigration Through Interposer Design appeared first on Semiconductor Engineering . ## [Home of the Agentic Pull Request (Sponsored)](https://crawlproof.com/a/hbVbW9jAm6at) _2026-08-20 · **Sponsored**_ CLI-first, TUI-ready toolkits and a moshscript installer — join the waitlist ## [CFETs Forge Better Connections](https://semiengineering.com/cfets-forge-better-connections/) _2026-08-20 · Laura Peters · Semiconductor Engineering_ Performance advantage may come down to material choices and precise interconnect decisions. The post CFETs Forge Better Connections appeared first on Semiconductor Engineering . ## [UK startup Callosum raises $100m](https://www.electronicsweekly.com/news/business/uk-startup-callosum-raises-100m-2026-08/) _2026-08-20 · David Manners · Electronics Weekly_ Callosum’s $100m seed round, one of the largest ever raised in Europe, was headed by Atomico, alongside Plural, DCVC, UK Sovereign AI and others. Callosum is building the essential layer \[…\] The post UK startup Callosum raises $100m appeared first on Electronics Weekly . ## [Birmingham researchers create multi-responsive gel](https://www.electronicsweekly.com/news/business/birmingham-researchers-create-multi-responsive-gel-2026-08/) _2026-08-20 · David Manners · Electronics Weekly_ University of Birmingham scientists have developed a new material that changes from a gel to a liquid-like state under UV light and can be rebuilt using heat or dismantled by \[…\] The post Birmingham researchers create multi-responsive gel appeared first on Electronics Weekly . ## [Sensor detects users of smart glasses, earphones and AR/VR devices](https://www.electronicsweekly.com/news/business/sensor-detects-users-of-smart-glasses-earphones-and-ar-vr-devices-2026-08/) _2026-08-20 · David Manners · Electronics Weekly_ Vishay is sampling a fully integrated short distance VCSEL-based proximity sensor. The VCNL36829UM combines a photodiode, asic, 16-bit ADC and smart dual I²C slave address in a compact 1.6×1.0x0.35mm transparent \[…\] The post Sensor detects users of smart glasses, earphones and AR/VR devices appeared first on Electronics Weekly . ## [Machine vision for robots, vehicles and construction equipment](https://www.electronicsweekly.com/news/business/machine-vision-for-robots-vehicles-and-construction-equipment-2026-08/) _2026-08-20 · David Manners · Electronics Weekly_ Basler and Syslogic are joining forces to bring machine vision and edge AI together by integrating Basler’s ace 2 GMSL cameras with Syslogic’s computers. Autonomous mobile robots, agricultural vehicles, construction \[…\] The post Machine vision for robots, vehicles and construction equipment appeared first on Electronics Weekly . ## [eGaN transistors for power conversion in space-based computing systems](https://www.electronicsweekly.com/news/business/egan-transistors-for-power-conversion-in-space-2026-08/) _2026-08-20 · David Manners · Electronics Weekly_ EPC (Efficient Power Conversion) Space has come up with three new eGaN power transistors in plastic surface-mount packages, designed to deliver high-performance power conversion for space computing systems. The EPC7050PCSH, \[…\] The post eGaN transistors for power conversion in space-based computing systems appeared first on Electronics Weekly . ## [Toshiba sampling Arm Cortex-M4 MCUs](https://www.electronicsweekly.com/news/business/toshiba-sampling-arm-cortex-m4-mcus-2026-08/) _2026-08-20 · David Manners · Electronics Weekly_ Toshiba has engineering samples of the TXZ+ Family Entry-Class M4V Group of standard microcontrollers. Featuring an Arm Cortex-M4 core with a floating-point unit (FPU) operating at up to 80MHz, the \[…\] The post Toshiba sampling Arm Cortex-M4 MCUs appeared first on Electronics Weekly . ## [The Future Of AI Compute Won’t Run On Just One Kind Of Chip](https://semiengineering.com/the-future-of-ai-compute-wont-run-on-just-one-kind-of-chip/) _2026-08-19 · Liz Allan · Semiconductor Engineering_ Power, token cost, interconnects, and software orchestration are pushing data centers toward heterogeneous clusters built from CPUs, GPUs, NPUs, optics, and custom accelerators. The post The Future Of AI Compute Won’t Run On Just One Kind Of Chip appeared first on Semiconductor Engineering . ## [Blog Review: Aug. 19](https://semiengineering.com/blog-review-aug-19-3/) _2026-08-19 · Jesse Allen · Semiconductor Engineering_ Memory tagging; digital twin of the Moon; packaging moves front-and-center; streaming sensor data. The post Blog Review: Aug. 19 appeared first on Semiconductor Engineering . ## [Open coordination for humans & AI (Sponsored)](https://crawlproof.com/a/aUL452ZJKTqR) _2026-08-19 · **Sponsored**_ Shared schemas and CLI tooling to validate, route, and audit human-agent workflows. ## [Chip Industry Technical Paper Roundup: Aug. 18](https://semiengineering.com/chip-industry-technical-paper-roundup-aug-18/) _2026-08-18 · Linda Christensen · Semiconductor Engineering_ 2D CFET scaling; PIM chiplet voltage-droop control; advanced-node layout repair; lithography defect prediction; 3D-IC failure analysis; chiplet and interposer optimization; 4H-SiC wafer slicing. The post Chip Industry Technical Paper Roundup: Aug. 18 appeared first on Semiconductor Engineering .