# tsmc (blogs) — RSS Amplifier Recent posts from the 5 feeds in the RSS Amplifier directory that cover tsmc. Page: Feed: --- ## [Marvell Lands Major Deal with Google](https://chippub.substack.com/p/marvell-lands-major-deal-with-google) _2026-08-20 · Meng Li · ChipPub_ Marvell wins Google custom chip deal, TPU expansion, and up to $12B warrant stake in AI infrastructure race. ## [U6G "Golden Spectrum" Debuts, RadRock Strengthens RF Core](https://chippub.substack.com/p/u6g-golden-spectrum-debuts-radrock) _2026-08-19 · Meng Li · ChipPub_ U6G golden spectrum RF solution by RadRock boosts 6G connectivity and device performance. ## [Lassan több Ubuntu fut Windows 11-en, mint natívan telepítve](https://prohardver.hu/hir/ubuntu_lassan_tobb_fut_windows_11_mint_nativ.html) _2026-08-18 · Hírek, cikkek és videók - PROHARDVER!_ A Canonical mérnöki részlegének alelnöke szerint rengeteg ügyfél választja a WSL-t a közvetlen telepítés helyett. ## [Meta's First Training Chip Makes Official Debut](https://chippub.substack.com/p/metas-first-training-chip-makes-official) _2026-08-18 · Meng Li · ChipPub_ Meta MTIA 300 training chip with built‑in NICs, collective offload, and near‑memory compute delivers superior DLRM performance and cost advantages over GPUs. ## [Fiberglass Cloth Shortage: Exceptionally Severe!](https://chippub.substack.com/p/fiberglass-cloth-shortage-exceptionally) _2026-08-17 · Meng Li · ChipPub_ PCB material costs surge as Nan Ya raises CCL and PP prices 20–25%. Fiberglass cloth shortage worsens, supply tight through 2027, driving downstream price hikes. ## [2026 Doorknock Highlights Strategic Importance of U.S.-Taiwan Relationship](https://topics.amcham.com.tw/2026/08/2026-doorknock-highlights-strategic-importance-of-u-s-taiwan-relationship/) _2026-08-17 · Jeremy Olivier · Taiwan Business TOPICS_ The post 2026 Doorknock Highlights Strategic Importance of U.S.-Taiwan Relationship appeared first on Taiwan Business TOPICS AmCham Taiwan’s 2026 Doorknock found strong support for Taiwan in Washington, alongside calls for tangible contributions that reinforce its strategic value. Passing an ADTA remains key to sustaining bilateral momentum. ## [Broadening the Communications Outreach](https://topics.amcham.com.tw/2026/08/broadening-the-communications-outreach/) _2026-08-17 · Alex Myslinski · Taiwan Business TOPICS_ The post Broadening the Communications Outreach appeared first on Taiwan Business TOPICS Former AmCham Chair Jeffrey Williams reflects on the first bilingual \*Taiwan White Paper\* and the responsibility that came with the Chamber’s growing influence. ## [Taiwan’s Evolving Approach to Wildlife Conservation](https://topics.amcham.com.tw/2026/08/taiwans-evolving-approach-to-wildlife-conservation/) _2026-08-17 · James Baron · Taiwan Business TOPICS_ The post Taiwan’s Evolving Approach to Wildlife Conservation appeared first on Taiwan Business TOPICS Once criticized for its wildlife record, Taiwan has emerged as a conservation success story. Cooperation among government, scientists, NGOs, and local communities is helping native species recover while protecting fragile habitats. ## [FedEx Taiwan’s Paul Sousa on Engineering the Future of Logistics](https://topics.amcham.com.tw/2026/08/fedex-taiwans-paul-sousa-on-engineering-the-future-of-logistics/) _2026-08-17 · Alex Myslinski · Taiwan Business TOPICS_ The post FedEx Taiwan’s Paul Sousa on Engineering the Future of Logistics appeared first on Taiwan Business TOPICS FedEx Taiwan Managing Director Paul Sousa discusses how engineering, data, and AI are shaping more agile and resilient logistics networks—and why Taiwan is central to that transformation. ## [How Air Liquide Far Eastern is Investing in Taiwan’s Semiconductor Future](https://topics.amcham.com.tw/2026/08/how-air-liquide-far-eastern-is-investing-in-taiwans-semiconductor-future/) _2026-08-17 · Taiwan Business TOPICS · Taiwan Business TOPICS_ The post How Air Liquide Far Eastern is Investing in Taiwan’s Semiconductor Future appeared first on Taiwan Business TOPICS Air Liquide Far Eastern is expanding capacity, strengthening supply resilience, and lowering carbon intensity to support the next phase of Taiwan’s semiconductor growth. ## [Real SIMs for AI Agents (Sponsored)](https://crawlproof.com/a/sTgqdaO3mhBE) _2026-08-17 · **Sponsored**_ Pass 2FA and verifications with real carrier numbers via our API. ## [Intel: A Return to Storage?](https://chippub.substack.com/p/intel-a-return-to-storage) _2026-08-16 · Meng Li · ChipPub_ Intel rethinks memory strategy with new architectures, advanced packaging, and foundry services, aiming to redefine computing and storage integration in the AI era. ## [Egy alkalmazásba költözteti a Copilotöt a Microsoft](https://prohardver.hu/hir/microsoft_egy_alkalmazas_koltoztet_copilot.html) _2026-08-14 · Hírek, cikkek és videók - PROHARDVER!_ A cél a jelenleg széttagoltnak tűnő a funkciók egységesítése. ## [Chips: Getting Bigger and Bigger!](https://chippub.substack.com/p/chips-getting-bigger-and-bigger) _2026-08-14 · Meng Li · ChipPub_ How TSMC, Intel, and Samsung scale AI chips from nanometers to 14× reticle size with CoWoS, EMIB, and 3D stacking—yield, thermal, and system challenges explained. ## [Elképesztően jó kihozatallal működik a TSMC-féle CoWoS](https://prohardver.hu/hir/tsmc_cowos_elkepesztoen_jo_kihozatal_mukodik.html) _2026-08-13 · Hírek, cikkek és videók - PROHARDVER!_ A tajvani bérgyártó a chiplet dizájnokra is kínál nagyon hasznos szolgáltatásokat. ## [SerDes: The Decisive Factor](https://chippub.substack.com/p/serdes-the-decisive-factor) _2026-08-13 · Meng Li · ChipPub_ How SerDes high speed interconnect IP drives AI ASIC competition, with 448G adoption reshaping data center chips and cloud vendor strategies. ## [TSMC Advanced Packaging: Latest Insights](https://chippub.substack.com/p/tsmc-advanced-packaging-latest-insights) _2026-08-12 · Meng Li · ChipPub_ TSMC reveals latest advanced packaging progress including CoWoS capacity, 5.5x reticle mass production with 98% yield, SoIC hybrid bonding, and ABF substrate challenges in the AI era. ## [A TSMC után a Samsung sem erőltetné a High-NA EUV berendezéseket](https://prohardver.hu/hir/samsung_sem_eroltet_high-na_euv_atallas.html) _2026-08-12 · Hírek, cikkek és videók - PROHARDVER!_ A dél-koreai óriáscég szerint 1 nm-es csíkszélesség alatt lehet szükség a váltásra. ## [Taiwan’s Chip Ecosystem Heads Across the Pacific](https://topics.amcham.com.tw/2026/08/taiwans-chip-ecosystem-heads-across-the-pacific/) _2026-08-12 · Hannah Gardner · Taiwan Business TOPICS_ The post Taiwan’s Chip Ecosystem Heads Across the Pacific appeared first on Taiwan Business TOPICS As TSMC expands in Arizona, more Taiwanese chip suppliers are weighing deeper investments in the United States. Their decisions could determine whether U.S. semiconductor ambitions grow into a durable, fully integrated industry. ## [Next-Gen EUV Lithography: Samsung Decides](https://chippub.substack.com/p/next-gen-euv-lithography-samsung) _2026-08-11 · Meng Li · ChipPub_ Samsung targets 1nm chip mass production with High-NA EUV by 2030, challenging TSMC and Intel in next-gen lithography. ## [A komponensek drágulása mellett a Microsoft sem kíméli a PC-gyártókat](https://prohardver.hu/hir/microsoft_windows_oem_licenc_dragul.html) _2026-08-10 · Hírek, cikkek és videók - PROHARDVER!_ A redmondi óriáscég emel a Windows licencköltségén, ami nagyon nem hiányzott a piacnak. ## [Unlimited Mobile Internet, One V-SIM (Sponsored)](https://crawlproof.com/a/0NSEiN5Qmhho) _2026-08-10 · **Sponsored**_ Automatically switches across T-Mobile, AT&T and Verizon; no throttling, no contract. ## [Why TSMC Remains Indomitable](https://topics.amcham.com.tw/2026/08/why-tsmc-remains-indomitable/) _2026-08-10 · Matthew Fulco · Taiwan Business TOPICS_ The post Why TSMC Remains Indomitable appeared first on Taiwan Business TOPICS Fueled by the AI boom, advanced packaging, and overseas expansion, TSMC is strengthening its global lead while navigating labor constraints, geopolitical risk, and competition with China. ## [All Eyes Are on EUV Lithography Machines](https://chippub.substack.com/p/all-eyes-are-on-euv-lithography-machines) _2026-08-10 · Meng Li · ChipPub_ EUV lithography is expanding beyond top five chipmakers as second-tier fabs adopt it, while new challengers target ASML's dominance. ## [Is Musk About to Disrupt EUV Lithography?](https://chippub.substack.com/p/is-musk-about-to-disrupt-euv-lithography) _2026-08-09 · Meng Li · ChipPub_ Elon Musk may disrupt EUV lithography using FEL technology. Explore the potential and challenges of this next generation light source. ## [Modellspecifikus hardvertervezésben utazna a Taalas felvásárlásával az AMD](https://prohardver.hu/hir/amd_taalas_modellspecifikus_hardvertervezes.html) _2026-08-07 · Hírek, cikkek és videók - PROHARDVER!_ A nagyobb chiptervezők eddig a gépi tanulás következtetés szakaszának bajnokdizájnjaival közösködtek, de a jövőben ez sem lehet elég. ## [America Bets on the "Post-GPU Era"](https://chippub.substack.com/p/america-bets-on-the-post-gpu-era) _2026-08-07 · Meng Li · ChipPub_ US shifts chip strategy from factory subsidies to equity stakes in seven disruptive tech firms, betting on CPO, ferroelectric memory, and post-GPU innovations. ## [Eltüntette korábbi, Windowshoz írt memóriaajánlását a Microsoft](https://prohardver.hu/hir/microsoft_eltuntette_korabbi_windows_memoriaajanla.html) _2026-08-06 · Hírek, cikkek és videók - PROHARDVER!_ A vállalat a nyár folyamán rájött, hogy a májusi blogbejegyzésben közöltnél kevesebb memória is elég. ## [Megfizethető ASUS ROG kütyü, ami nélkül élni sem lehet](https://prohardver.hu/hir/asus_rog_strix_xin120_argb-s_kiegeszito.html) _2026-08-06 · Hírek, cikkek és videók - PROHARDVER!_ Ha az ablakos házunk hűtése már rendben van, de még maradt szabad helyünk, ahová ventilátort telepíthetnénk, díszítéshez is felhasználhatjuk azt. ## [Csökkentené a Windows 11 memóriahasználatát a Microsoft](https://prohardver.hu/hir/microsoft_csokkentene_windows_11_memoriahasznalat.html) _2026-08-03 · Hírek, cikkek és videók - PROHARDVER!_ Ez kifejezetten nagy segítség lehet a nagyon olcsó, 8 GB RAM-mal rendelkező PC-knek. ## [Gyorsít az 1,4 nm-es node bevezetésén a TSMC](https://prohardver.hu/hir/tsmc_gyorsit_1_4_nm_node_bevezetes.html) _2026-07-30 · Hírek, cikkek és videók - PROHARDVER!_ A próbagyártásra akár egy év múlva sor kerülhet. ## [UMC Posts Strong Q2 Earnings, Sees AI Revenue More Than Triple in 3 Years](https://techsoda.substack.com/p/umc-posts-strong-q2-earnings-sees) _2026-07-29 · Judy Lin 林昭儀 · TechSoda: Industry Spotlight_ Board approves multi-year $5 billion budget to build out 12-inch silicon photonics and 3D advanced packaging capacity. ## [One platform, from silicon to agent (Sponsored)](https://crawlproof.com/a/LG8sgpVXSHi6) _2026-07-29 · **Sponsored**_ Serverless inference plus Inference Router to optimize cost and latency at scale. ## [TechSoda Insight: Microsoft & AMD Double Down on Full-Rack AI Infrastructure](https://techsoda.substack.com/p/techsoda-insight-microsoft-and-amd) _2026-07-20 · TechSoda Research · TechSoda: Industry Spotlight_ Microsoft’s latest Azure infrastructure update (July 20, 2026, announced by Cloud + AI EVP Scott Guthrie) signals a significant shift in how hyperscalers build and deploy AI capacity. ## [IP Insight: What Defensive Leverage Does TSMC Hold Against HPE's Infringement Claim? (Part 2)](https://techsoda.substack.com/p/ip-insight-what-defensive-leverage) _2026-06-30 · Cecilia Liu · TechSoda: Industry Spotlight_ In the global semiconductor supply chain, patent litigation has always been an extension of commercial competition. ## [Beyond Moore’s Law: How Advanced Packaging May Become the New Geopolitical Chessboard](https://techsoda.substack.com/p/beyond-moores-law-how-advanced-packaging) _2026-06-29 · Judy Lin 林昭儀 · TechSoda: Industry Spotlight_ How the Post-Moore’s Law Era and Apple's CXMT Lobbying Signal a New Paradigm of Weaponized Interdependence ## [IP Insight: Why the Latest Patent Lawsuit Won’t Easily Break TSMC’s Shield (Part 1)](https://techsoda.substack.com/p/ip-insight-why-the-latest-patent) _2026-06-14 · Cecilia Liu · TechSoda: Industry Spotlight_ The global semiconductor landscape is no stranger to legal warfare, but the latest U.S. ## [Huawei’s Chip Breakthrough: Genuine Leap or Strategic Hype?](https://techsoda.substack.com/p/huaweis-chip-breakthrough-genuine) _2026-05-26 · Judy Lin 林昭儀 · TechSoda: Industry Spotlight_ Can Huawei Really Beat U.S. Sanctions with a New Chip Breakthrough? ## [TSMC Unveils A13 Process Technology in 2026 North America Technology Symposium](https://techsoda.substack.com/p/tsmc-unveils-a13-process-technology) _2026-04-22 · Judy Lin 林昭儀 · TechSoda: Industry Spotlight_ TSMC, the world’s leading semiconductor foundry, held its 2026 North America Technology Symposium on April 22 (local time). ## [NAND Flash Shortage to Intensify Through 2027 as AI Demand Triggers "Structural Shift"](https://techsoda.substack.com/p/nand-flash-shortage-to-intensify) _2026-04-14 · Judy Lin 林昭儀 · TechSoda: Industry Spotlight_ Silicon Motion’s Wallace Kou: AI Demand is Real, but "Broken Chains" Risk Looms for Automotive and Industrial Sectors. ## [Beyond Displays: Taiwan’s Panel Giants Pivot Toward the Semiconductor Gold Rush](https://techsoda.substack.com/p/beyond-displays-taiwans-panel-giants) _2026-04-09 · Judy Lin 林昭儀 · TechSoda: Industry Spotlight_ How Taiwan’s Touch Taiwan 2026 Becomes a Stage for Industry Transformation and Resilience ## [The Terawatt Transition: Inside Musk’s Galactic Terafab Vision](https://techsoda.substack.com/p/the-terawatt-transition-inside-musks) _2026-03-24 · Judy Lin 林昭儀 · TechSoda: Industry Spotlight_ Scaling the Kardashev Scale through Vertical Integration and Space-Bound Compute ## [Atomic Layer Etching as a Scaling Enabler: From Isotropic Chemistry to Selective, Directional, and Geometry-Driven Patterning](https://www.blog.baldengineering.com/2025/12/atomic-layer-etching-as-scaling-enabler.html) _2025-12-23 · Jonas Sundqvist · BALD Engineering - Born in Finland, Born to ALD_ Continued scaling in semiconductor manufacturing increasingly relies on atomic-scale control of etching for complex 3D material stacks, making patterning precision a growing industrial bottleneck. Atomic layer etching (ALE) has emerged as a key enabler, with plasma-driven anisotropy and surface-chemistry control allowing improved selectivity and profile fidelity for advanced logic and memory… ## [Intel Foundry Advances Future Logic Scaling with Manufacturable 2D Transistors and High NA EUV Integration](https://www.blog.baldengineering.com/2025/12/intel-foundry-advances-future-logic.html) _2025-12-21 · Jonas Sundqvist · BALD Engineering - Born in Finland, Born to ALD_ Intel Foundry has demonstrated concrete momentum in de-risking 2D field-effect transistors as a future scaling path beyond silicon, through long-term collaboration with Imec . Results presented at IEDM show a world-first, 300 mm fab-compatible integration of key 2DFET modules, including source/drain contacts and gate stacks, using transition-metal dichalcogenide channels (WS₂ and MoS₂ for n-type,… ## [Nanexa and Moderna partner on ALD-based PharmaShell drug delivery platform in licensing deal with USD 3 million upfront payment](https://www.blog.baldengineering.com/2025/12/nanexa-and-moderna-partner-on-ald-based.html) _2025-12-12 · Jonas Sundqvist · BALD Engineering - Born in Finland, Born to ALD_ Nanexa and Moderna have entered into a license and option agreement covering the development of up to five undisclosed drug compounds using Nanexa’s PharmaShell® drug delivery platform. The agreement includes an upfront payment of USD 3 million to Nanexa, with the potential for up to USD 500 million in development and commercial milestone payments, as well as tiered single-digit royalties on… ## [Capacitive memory built on a TSMC CMOS chip (reported in Nature)](https://www.blog.baldengineering.com/2025/12/capacitive-memory-built-on-tsmc-cmos.html) _2025-12-09 · Jonas Sundqvist · BALD Engineering - Born in Finland, Born to ALD_ Researchers led by Junmo Lee from Georgia Institute of Technology in collaboration with Taiwan Semiconductor Manufacturing Company (TSMC) have demonstrated a new type of capacitive memory integrated directly on a CMOS chip. The work uses atomic layer deposition (ALD) and a dual-gated device architecture, pointing toward higher-density, low-power memory that can be integrated into advanced logic… ## [The 2026 Area Selective Deposition Workshop (ASD 2026)](https://www.blog.baldengineering.com/2025/11/the-2026-area-selective-deposition.html) _2025-11-12 · Jonas Sundqvist · BALD Engineering - Born in Finland, Born to ALD_ The ASD Workshop was initiated in 2016 to provide a scientific communication channel to learn and exchange about selective deposition techniques. It has since offered a forum for open discussions between researchers from academia and industry. The meeting will include one day of Tutorials followed by the Workshop at ETEC Building (University at Albany). The last day of the workshop will highlight… ## [Samsung Researchers Achieve Near-Perfect Grain Orientation in Atomic Layer Deposited Ruthenium for Next-Generation Interconnects](https://www.blog.baldengineering.com/2025/11/samsung-researchers-achieve-near.html) _2025-11-10 · Jonas Sundqvist · BALD Engineering - Born in Finland, Born to ALD_ Researchers at the Samsung Advanced Institute of Technology (SAIT) have unveiled a breakthrough in interconnect materials at IEDM 2025 with their paper “Grain-Orientation-Engineering of Atomic Layer Deposited Ruthenium Interconnect Technology.” As semiconductor scaling pushes below 10 nm, conventional copper wiring faces mounting resistance and reliability challenges. The SAIT team demonstrated… ## [IEDM2025 Tutorial - Atomic layer deposited atomically thin In₂O₃ transistors for BEOL logic and memory applications](https://www.blog.baldengineering.com/2025/11/iedm2025-tutorial-atomic-layer.html) _2025-11-10 · Jonas Sundqvist · BALD Engineering - Born in Finland, Born to ALD_ The IEDM 2025 T3 tutorial session titled “Atomic-layer-deposited atomically thin In₂O₃ transistors for BEOL logic and memory applications” will focus on recent progress in oxide semiconductor thin-film transistor (TFT) technologies designed for back-end-of-line (BEOL) 3D integration. The work is closely associated with Professor Peide (Peter) Ye’s group at Purdue University, which has been leading… ## [Applied Materials Deepens Partnership with Besi and Launches Kinex™ – the Industry’s First Fully Integrated Die-to-Wafer Hybrid Bonding System for Next-Gen AI and Memory Chips](https://www.blog.baldengineering.com/2025/11/applied-materials-deepens-partnership.html) _2025-11-08 · Jonas Sundqvist · BALD Engineering - Born in Finland, Born to ALD_ Applied Materials announced it has acquired a 9% stake in BE Semiconductor Industries (Besi) to strengthen their ongoing collaboration on hybrid bonding technology for advanced semiconductor packaging. Building on a partnership that began in 2020, the two companies recently extended their agreement to co-develop the industry’s first fully integrated die-based hybrid bonding system—combining… ## [Plasma-Based Deposition Refines ALD for Next-Gen DRAM: 30% Higher k, 40× Lower Leakage](https://www.blog.baldengineering.com/2025/10/plasma-based-deposition-refines-ald-for.html) _2025-10-27 · Jonas Sundqvist · BALD Engineering - Born in Finland, Born to ALD_ Researchers from POSTECH and UNIST in Korea have unveiled a new atomic-layer process using plasma-based deposition (PDP) to significantly improve DRAM capacitors. This innovation addresses a critical challenge in semiconductor manufacturing: enhancing the performance of high-k dielectric materials without introducing defects that cause electrical leakage. The PDP process refines the deposition of… ## [AlixLabs presents HAR narrow-fin patterning at ECS 248](https://www.blog.baldengineering.com/2025/10/alixlabs-presents-har-narrow-fin.html) _2025-10-26 · Jonas Sundqvist · BALD Engineering - Born in Finland, Born to ALD_ AlixLabs is pleased to announce that Dr. Dmitry Suyatin, CIPO and Co-Founder, has presented the company’s latest advances in APS™ (Atomic Layer Etching Pitch Splitting) at the 248th Electrochemical Society (ECS) Meeting held in Chicago, October 12–16, 2025. During the session, Dr. Suyatin highlighted new experimental results demonstrating high-aspect-ratio (HAR), narrow-fin patterning on bulk…