Applied Materials Deepens Partnership with Besi and Launches Kinex™ – the Industry’s First Fully Integrated Die-to-Wafer Hybrid Bonding System for Next-Gen AI and Memory Chips

Applied Materials announced it has acquired a 9% stake in BE Semiconductor Industries (Besi) to strengthen their ongoing collaboration on hybrid bonding technology for advanced semiconductor packaging. Building on a partnership that began in 2020, the two companies recently extended their agreement to co-develop the industry’s first fully integrated die-based hybrid bonding system—combining…