# imec (news sources) — RSS Amplifier

Recent posts from the 1 feeds in the RSS Amplifier directory that cover imec.

Page: <https://rssamplifier.com/topics/imec/news>  
Feed: <https://rssamplifier.com/topics/imec/news.md>

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## [Chip Industry Week In Review](https://semiengineering.com/chip-industry-week-in-review-152/)

_2026-08-21 · The SE Staff · Semiconductor Engineering_

New Micron lab; chip/AI price jump; multi-die monitoring; cryo links for quantum chips; interconnect RC bottleneck; 18A win; CPO roadmap; 2 new CEOs; humanoid readiness gap; Hot Interconnects. The post Chip Industry Week In Review appeared first on Semiconductor Engineering .

## [Don&#8217;t Scrap It, Save It: Feedforward Control For Modern Semiconductor Manufacturing](https://semiengineering.com/dont-scrap-it-save-it-feedforward-control-for-modern-semiconductor-manufacturing/)

_2026-08-20 · Swapnil Kailash More · Semiconductor Engineering_

By measuring each wafer after lithography and adjusting the next etch step, fabs can pull more wafers back into spec. The post Don’t Scrap It, Save It: Feedforward Control For Modern Semiconductor Manufacturing appeared first on Semiconductor Engineering .

## [From Research To Production: Collaboration Is Key For Semiconductor Innovation](https://semiengineering.com/from-research-to-production-collaboration-is-key-for-semiconductor-innovation/)

_2026-08-20 · Germain Fenger · Semiconductor Engineering_

Semiconductor R&D depends on access to high-quality data, realistic process assumptions, and practical learning from silicon. The post From Research To Production: Collaboration Is Key For Semiconductor Innovation appeared first on Semiconductor Engineering .

## [How Will The Custom HBM Business Work?](https://semiengineering.com/how-will-the-custom-hbm-business-work/)

_2026-08-20 · Bryon Moyer · Semiconductor Engineering_

There is no one-size-fits-all — yet. The post How Will The Custom HBM Business Work? appeared first on Semiconductor Engineering .

## [Reducing Scope 3 Value Chain Emissions For Customers Through Sustainability And Innovation](https://semiengineering.com/reducing-scope-3-value-chain-emissions-for-customers-through-sustainability-and-innovation/)

_2026-08-20 · Madison West · Semiconductor Engineering_

Reducing manufacturing-related emissions may support lowering the embedded carbon footprint of the chips customers use in their products. The post Reducing Scope 3 Value Chain Emissions For Customers Through Sustainability And Innovation appeared first on Semiconductor Engineering .

## [Three Strategic Imperatives For Energy-Efficient AI Computing](https://semiengineering.com/three-strategic-imperatives-for-energy-efficient-ai-computing/)

_2026-08-20 · Pushkar Apte · Semiconductor Engineering_

Reducing energy consumption is key to both lowering inference cost and enabling emerging physical AI applications. The post Three Strategic Imperatives For Energy-Efficient AI Computing appeared first on Semiconductor Engineering .

## [Managing Thermal Expansion And Electromigration Through Interposer Design](https://semiengineering.com/managing-thermal-expansion-and-electromigration-through-interposer-design/)

_2026-08-20 · Katherine Derbyshire · Semiconductor Engineering_

New deep learning models may provide a pathway for modeling warpage. The post Managing Thermal Expansion And Electromigration Through Interposer Design appeared first on Semiconductor Engineering .

## [CFETs Forge Better Connections](https://semiengineering.com/cfets-forge-better-connections/)

_2026-08-20 · Laura Peters · Semiconductor Engineering_

Performance advantage may come down to material choices and precise interconnect decisions. The post CFETs Forge Better Connections appeared first on Semiconductor Engineering .

## [The Future Of AI Compute Won’t Run On Just One Kind Of Chip](https://semiengineering.com/the-future-of-ai-compute-wont-run-on-just-one-kind-of-chip/)

_2026-08-19 · Liz Allan · Semiconductor Engineering_

Power, token cost, interconnects, and software orchestration are pushing data centers toward heterogeneous clusters built from CPUs, GPUs, NPUs, optics, and custom accelerators. The post The Future Of AI Compute Won’t Run On Just One Kind Of Chip appeared first on Semiconductor Engineering .

## [Blog Review: Aug. 19](https://semiengineering.com/blog-review-aug-19-3/)

_2026-08-19 · Jesse Allen · Semiconductor Engineering_

Memory tagging; digital twin of the Moon; packaging moves front-and-center; streaming sensor data. The post Blog Review: Aug. 19 appeared first on Semiconductor Engineering .

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_2026-08-19 · **Sponsored**_

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## [Chip Industry Technical Paper Roundup: Aug. 18](https://semiengineering.com/chip-industry-technical-paper-roundup-aug-18/)

_2026-08-18 · Linda Christensen · Semiconductor Engineering_

2D CFET scaling; PIM chiplet voltage-droop control; advanced-node layout repair; lithography defect prediction; 3D-IC failure analysis; chiplet and interposer optimization; 4H-SiC wafer slicing. The post Chip Industry Technical Paper Roundup: Aug. 18 appeared first on Semiconductor Engineering .

