Connecting The Global Electronics Industry
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Synopsys’s CXL 4.0 IP aims to help designers build faster, more flexible and secure disaggregated computing architectures as AI systems demand more memory capacity and bandwidth. The post Synopsys Updates CXL IP Portfolio for AI-Era Infrastructure appeared first on EE Times .
Andes Technology’s decision to close Condor was part of a broader 10-20% operational cost-cutting exercise, with Condor probably considered too expensive a bet. The post Andes Condor Closure Came Amid Broader Cost-Cutting Effort appeared first on EE Times .
IBM’s new cryogenic architecture tackles one obstacle to fault-tolerant quantum computing, while exposing wiring, control, interconnect, and reliability challenges. The post IBM Makes Quantum Cryogenics Modular, but Scaling Problems Remain appeared first on EE Times .
Learn how to run local LLMs on Arduino UNO Q — from model selection and quantization to memory constraints and real-world edge AI use cases. The post Running Local LLMs on the Arduino® UNO™ Q Board: a Practical Guide appeared first on EE Times .
As Matter matures, manufacturers face a new challenge: maintaining visibility into connected products after deployment. The post When Interoperability Becomes Infrastructure appeared first on EE Times .
Marvell attacks AI’s memory choke point with SSD, CXL, and photonic fabrics to push data nearer compute. The post Marvell Targets AI Bottlenecks with Memory-Disaggregation Portfolio appeared first on EE Times .
Humanoids won’t scale on AI hype alone; standardized MIPI interfaces can cut power, wiring, and cost. The post Why Standardized Interfaces Are Critical to Accelerating Humanoid Development appeared first on EE Times .
Nvidia positions classical computing infrastructure as a critical layer in the race to build useful quantum computers. The post Nvidia Bets on the Classical Side of Quantum Computing appeared first on EE Times .
Join this webinar and discover the OPTIGA™ Connect Consumer OC1230, the world's smallest, ultra-low-power eSIM solution built on Infineon's TEGRION™ 28 nm tech. The post Tiny eSIM, Global Reach: Simplifying Cellular Connectivity for Consumer Electronics appeared first on EE Times .
Automotive electronic systems face relentless pressure to meet electromagnetic compatibility (EMC), signal integrity (SI), and power integrity (PI) targets while satisfying strict ASIL safety requirements. Too often, engineers discover problems late: EMC failures surface during vehicle integration, signal ringing degrades high-speed links, via stub resonance reflects energy above 3 Gbps, power…
